[Lingang Xingang Integrated Wafer Manufacturing Project Starts Construction] On June 29, 2026, the groundbreaking ceremony of the Lingang New Area Xingang Integration Project was held at the project site in Xinlu Village, Wanxiang Town. The total construction area of the first phase of the project is about 620000 square meters. After completion, it will focus on the research and manufacturing of 55nm to 28nm planar process integrated circuits, providing professional integrated circuit outsourcing services to global customers. The first phase is planned to start construction in the third quarter of 2026 and be delivered for use by the end of 2027, further improving the integrated circuit industry ecosystem in Lingang. Editor/Cheng Liting

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