[Malaysia's closed testing capacity card AI supply chain] In September 2026, Malaysia controls approximately 13% of the global semiconductor packaging and testing capacity, making it the sixth largest chip exporting country in the world. Intel, Tongfu Microelectronics and other companies have deeply laid out advanced packaging in Penang, and Tongfu Microelectronics has completed 3nm multi chip packaging verification. The country has established the National Advanced Packaging Alliance and plans to achieve mass production of 2.5D packaging by 2028.Editor/Gao Xue

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• 2026.10.15 11:24
• [Liu Haixing Meets Saudi Ambassador to China Alharbi and GCC Envoys in Beijing]
• On October 14, 2026, Liu Haixing met with Saudi Ambassador to China Halby in Beijing and had a collective exchange with the Gulf Cooperation Council's ambassadors in China. Both sides reviewed the achievements of China Saudi Arabia China Sea cooperation and exchanged views on deepening strategic mutual trust, expanding practical cooperation, and promoting peace and stability in the Middle East region. Editor/Min Jing

• 2026.10.15 11:23
• [Dongfang Electric Boiler Lights Up at Huaneng Haimen Project]
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