The 27th CIOE will be held at the Shenzhen International Convention and Exhibition Center from September 9th to 11th. SUNA unveiled its core products at the Infrared Hall 8A10 and Communication Hall 13A61, showcasing its technological strength in the field of wafer level optics and passive devices.

During the exhibition, the SUNA team had in-depth exchanges with numerous clients. The Communication Hall showcases micro nano optical and capacitive solutions for CPO/NPO/OIO, high-performance computing, optical modules, and consumer electronics scenarios; The Infrared Pavilion showcases products such as gratings and infrared lenses, attracting a large number of professional visitors to stop and inquire. The technical team focuses on core capabilities such as deep silicon etching technology and optical simulation design, providing customers with customized optoelectronic solutions with multiple scenarios and high reliability.

The SUNA technical team is stationed throughout the entire process, providing solutions to industry pain points such as CPO high-density coupling, OCS deployment optical requirements, and advanced packaging low loss solutions, based on actual projects. Many customers brought specific R&D needs to the scene, carefully compared and exchanged customized parameters, and the atmosphere of on-site discussion was lively.

In response to the urgent demand for high-speed interconnection and advanced packaging in AI computing power, wafer level optical and passive devices serve as the underlying core support, and their technological and industrial value continue to be highlighted. In the future, SUNA will continue to cultivate this track, polishing product solutions with higher performance, lower losses, and higher reliability, and working together with industry chain partners to promote the commercialization and industrial upgrading of optoelectronic technology.Editor/Cheng Liting