The 23rd Elexcon ended perfectly at the Shenzhen International Convention and Exhibition Center. This exhibition was held simultaneously with CIOE, bringing together more than 5000 companies and focusing on cutting-edge fields such as advanced packaging, infrared optoelectronics, embedded hardware, micro nano optics, etc. It connects the complete industry chain from chip design, packaging and testing manufacturing to terminal computing applications, and is an annual electronic industry event of great significance in South China.

At this industry event, SUNA, which is deeply involved in the field of wafer level micro nano optics and silicon-based passive devices, made a heavyweight appearance with its core products, showcasing a series of high-density silicon capacitor solutions that are suitable for AI computing power and advanced packaging scenarios.

With the continuous explosion of AI computing power, high-performance chips and advanced packaging technologies are rapidly iterating, and traditional device solutions are gradually encountering bottlenecks in bandwidth, power consumption, and volume. High density silicon capacitors, with their advantages of small size, high capacitance, ESL, etc., have become a key passive component supporting high-performance chip power supply and advanced packaging integration, and are also one of the breakthrough directions of the industry's common concern. SUNA relies on its full chain self-developed manufacturing capabilities to continuously provide core device support for high-speed interconnection and advanced packaging scenarios, helping to reduce costs and increase efficiency of computing infrastructure from the bottom device level.

During the exhibition, the SUNA technical team had in-depth discussions with visiting customers and industry partners, focusing on the difficulties of advanced packaging integration processes, consistency in device mass production, and customized development for customers. They listened to the real market demand and shared their experience in mass production and implementation of silicon-based passive devices. Many industry clients have further coordinated on project validation and sample development, creating a lively atmosphere for on-site communication.

Looking towards the future, the trend of computing power upgrade will not stop. SUNA will continue to take root in the wafer level micro nano optics and silicon-based passive device track, adhere to technological innovation driven, continuously polish product performance, optimize large-scale production capabilities, and iteratively adapt to the next generation of high-speed interconnect and advanced packaging device solutions. At the same time, we will deepen collaborative cooperation with upstream and downstream of the industrial chain, work together with industry partners to overcome the pain points of technology implementation, and use stable and reliable domestic core components to support the high-quality development of the optical communication and semiconductor advanced packaging industries. We will seize new opportunities in the era of computing power together with industry partners.Editor/Cheng Liting