A small chip is connecting critical links for the new generation of communication networks. The world's first mass-produced intelligent terminal silicon-based gallium nitride RF chip independently developed by China Electronics Technology Group Corporation (CETC) 55th Institute has recently delivered over 5 million units. This achievement has enabled the chip to achieve large-scale commercial use in the global intelligent terminal market, and has also laid a solid hardware foundation for the construction of integrated information networks and the development of high-speed interconnectivity across all domains.
Chips build a solid foundation for network operation
The integrated information network of space, sky, and earth is the core foundation of 6G communication, commercial aerospace, low altitude economy, and emergency communication fields. Low cost and high-performance power amplifier chips can be regarded as the signal heart of communication systems, directly affecting communication transmission rate, signal coverage range, and overall operational stability.

Currently, the pace of commercial aerospace, low altitude economy, 6G technology research and development, and communication industry development in China continues to accelerate, and the market demand for cost-effective RF chips is rapidly growing.
Empowering a new ecosystem of interconnectivity across all domains
This silicon-based gallium nitride RF chip has advantages such as high power, high efficiency, ultra wideband, and high reliability, fully meeting the high standard requirements for power amplifier chip efficiency and linearity in air space integrated communication. Keywords: chip, intelligent, 6G

This technological breakthrough has successfully overcome the bottleneck of the industrialization of high-end RF chips, laying a solid foundation for building a global, all time, and no dead corners air space communication network, and accelerating the achievement of the industrial goals of seamless communication and the Internet of Things worldwide.Editor/Gong Ziwei
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