The demand for AI and new energy in the semiconductor industry continues to rise, and the capacity gap for 12 inch analog chips continues to widen. Local wafer manufacturing companies are accelerating their expansion and layout. United Nova Technology Co., Ltd.‌ has finalized a large-scale capital increase cooperation, jointly injecting a total of 2.666 billion yuan of funds into Xinlian Advanced through the Industry Fund, and fully promoting the fourth phase project of 12inch automotive grade series modular hybrid chip manufacturing with a total investment of 20 billion yuan. The project covers multiple high growth tracks such as automobiles, AIcomputing power, and silicon photonics, and is paired with new high-pressure silicon carbide products to achieve technological breakthroughs and fill the gaps in domestic high-end analog chip manufacturing.

Capital increase, landing and expansion of production

United Nova Technology Co., Ltd.‌ and Shaoxing Keqiao Industrial Fund signed a shareholder agreement for capital increase, with the Industrial Fund contributing 2.004 billion yuan and United Nova Technology Co., Ltd.‌ contributing 662 million yuan. After the capital increase, the advanced registered capital of Xinlian reached 2.675 billion yuan, with industrial funds holding 74.90% of the shares and United Nova Technology Co., Ltd.‌ holding 25.10%. All funds will be used for the fourth phase of the 12 inch automotive grade series modular hybrid chip manufacturing project with a total investment of 20 billion yuan, to help enterprises expand into high prosperity tracks such as AI servers and new energy vehicles, and improve the layout of the high-end analog chip industry.

Multi process coverage track

The fourth phase project builds five core process platforms, covering multiple technical routes including 55 to 28 nanometer automotive MCU and AI side DSP, 90 nanometer digital analog chip, AI server power management, silicon optical, SiGe amplification chip. The product has landed in the high-end consumer electronics market of intelligent automotive industrial automation AIoT, with two platforms directly connected to the AI computing power industry. At present, the global demand for 12 inch silicon wafers is driven by AI, and the consumption of silicon wafers for AI servers is 3.8 times that of ordinary servers. By 2026, the related demand will reach 1 million wafers per month. The self-sufficiency rate of analog chips in China is insufficient, and project production will effectively fill the market gap.

Dual promotion of technical performance

In the first quarter of 2026, United Nova Technology Co., Ltd.‌'s revenue was 1.962 billion yuan, a year-on-year increase of 13.19%. The scale of losses narrowed year-on-year, and the operating cash flow increased by 9.61% to 188 million yuan.UNT Power, a subsidiary of UNT Power, has launched 3300V silicon carbide MOSFET devices and completed customer sample delivery, filling the gap in domestic solid-state transformer high-voltage devices and reducing system costs by 20 to 35 percentage points. The enterprise is deeply engaged in power simulation chip outsourcing and has a complete platform for mass production of automotive grade chips, continuously providing local chip manufacturing solutions for the global AI new energy industrial control industry.Editor/Min Jing