The lights in the wafer fab stayed on all night, and the engineers' gaze shifted from the nanoscale transistors to the thin glass like cicada wings. When the ceiling of computing power is within reach, the key to breaking the shackles of encapsulation is finally quietly turned in the game of brittleness and resilience, illuminating another secluded path in the post Moore era.

Industry welcomes new cooperation

The performance of a chip often depends not only on the manufacturing process of the transistors themselves, but also on the foundation that supports them. For a long time, organic substrates and silicon interlayers have been the mainstream of chip packaging, but under the almost greedy consumption of computing power by AI big models, this old foundation has become somewhat cramped. The emergence of glass substrates is not a simple material replacement, but a reconstruction of the underlying physical logic.

The brittle bottleneck has been overcome

The technology war ignited by giants such as Intel is gradually becoming a wildfire under the active response of the Chinese industrial chain. From overcoming the brittleness of glass to facing the last mile of through-hole yield, the focus of competition in the industry has shifted from feasibility verification in the laboratory to cost control and process collaboration in factories. This is not only a victory for materials, but also a touchstone for systems engineering capabilities.

The production rhythm has been clearly defined

It is worth noting that the world is almost on the same track in this race. This provides a rare opportunity for China's semiconductor industry to change lanes and overtake. Although there are still shortcomings in high-end equipment and special materials, domestic enterprises' multiple breakthroughs in TGV technology have demonstrated the resilience of localized development. Keywords: glass substrate packaging TGV、 Advanced Packaging, Intel

When computing power becomes the oil of the new era, this piece of glass becomes a bridge connecting reality and the future. Whoever can achieve stability and cost-effectiveness in mass production in this area first will have the initiative to define the next generation of high-performance computing in the post Moore era. This is not just a technological race, but also a deep test of the independent and controllable ability of the industrial chain.Editor/Gong Ziwei